31.190 电子元器件组件 标准查询与下载

T/GBG 0001-2018 LED照明标准光组件接口与性能要求：5050封装器件

本标准规定了满足LED照明标准光组件认定条件的5050封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: 5050 Packaged Devices

T/GBG 0003-2018 LED照明标准光组件接口与性能要求：1717封装器件

本标准规定了满足LED照明标准光组件认定条件的1717封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: 1717 Packaged Devices

T/GBG 0004-2018 LED照明标准光组件接口与性能要求：D215封装器件

本标准规定了满足LED照明标准光组件认定条件的D215封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: D215 Packaged Devices

T/GBG 0002-2018 LED照明标准光组件接口与性能要求：2016封装器件

本标准规定了满足LED照明标准光组件认定条件的2016封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: 2016 Packaged Devices

T/GBG 0008-2018 LED照明标准光组件接口与性能要求：光源模块3

本标准规定了满足LED照明标准光组件认定条件的光源模块封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

Interface and performance requirements of LED lighting standard optical components: light source module 3

T/GBG 0005-2018 LED照明标准光组件接口与性能要求：LED灯条

本标准规定了满足LED照明标准光组件认定条件的LED灯条（在本标准文中简称为“灯条”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: LED Light Bar

DIN EN IEC 61190-1-3:2018 电子组件用连接材料.第1-3部分:电子级钎焊合金及有焊剂和无焊剂要求电子焊接用固体焊料(IEC 61190-1-3-2017); 德文版本EN IEC 61190-1-3-2018

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018

IEC 61760-4:2015+AMD1:2018 CSV 表面安装技术第4部分:湿敏器件的分类、包装、标签和处理

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC 61760-4:2015/AMD1:2018 修改件1.表面安装技术.第4部分:湿敏器件的分类、包装、标签和处理

Amendment 1 - Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

EN IEC 61190-1-3:2018 电子组装用附件材料 第 1-3 部分：电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊料的要求

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

IEC 61190-1-3:2017 电子组装用附件材料 - 第1-3部分:电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊剂的要求

"This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys@ for fluxed and non-fluxed bar@ ribbon@ powder solders and solder paste@ for electronic soldering applications and for ""special"" electronic grade solders. For the generic specifications of solder alloys and fluxes@ see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes@ ingots@ preforms@ bars with hook and eye ends@ and multiple-alloy solder powders."

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

EN 61191-2:2017 印制板组件 第2部分：分规范 表面安装焊接组件的要求

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.). This edition includes the following significant technical changes with respect to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added.

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

GSO IEC 62137-4:2017 电子组装技术 第4部分：面阵型封装表面贴装器件焊点耐久性测试方法

This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment. An acceleration factor for the degradation of the solder joints of the packages by the temperature cycling test due to the thermal stress when mounted, is described Annex A. Annex H provides some explanations concerning various types of mechanical stress when mounted. The test method specified in this standard is not intended to evaluate semiconductor devices themselves. NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be used to guarantee the mounting reliability of the packages. NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use and handling after mounting.

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices

IEC 60068-2-58:2015+AMD1:2017 CSV 环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属化物溶解性和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

EN 62090:2017 使用条形码和二维符号的电子元器件用产品包装标签

IEC 62090:2017(E) applies to labels on the packaging of electronic components for automatic handling in B2B processes. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution in B2C processes are also excluded from this document. Bar code and 2D symbol markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and distribution. This edition includes the following significant technical changes with respect to the previous edition: a) Applicable data elements have been added. Data identifiers of those data elements are “10D”, “14D”, ”2P”, “25L”, “18V”, “V”, “J”, “3S”, “13E”, “33L” and “34L”. b) The following new informative annexes have been added: - Annex C, URL; - Annex D, Examples of data element short titles; - Annex E, Package levels for component package labels.

Product package labels for electronic components using bar code and two- dimensional symbologies

EN 62739-3:2017 使用熔融无铅焊料合金的波峰焊设备侵蚀试验方法 第3部分：侵蚀试验方法选择指南

IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

DB34/T 2829-2017 超厚电解铜箔技术条件

本标准规定了超厚电解铜箔的术语和定义、技术要求、型号与规格、技术要求、试验方法、检验规 则以及标志、包装、运输、贮存。 本标准适用于印制电路板用超厚电解铜箔（以下简称铜箔）。

Technical conditions of ultra-thick electrolytic copper foil

JIS C 61760-4:2016 表面安装技术. 第4部分: 湿度敏感器件的分类, 包装, 标记和处理

Surface mounting technology -- Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

EN 62739-2:2016 熔化无铅焊料合金波峰焊设备侵蚀试验方法 第2部分：表面处理金属材料侵蚀试验方法

IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at prevention of an accident or a fire by predicting a setup and life of a suitable maintenance cycle.

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing

JIS C 62137-4:2016 电子组装技术. 第4部分: 区域阵列类型包装表面安装设备的焊缝耐久性试验方法

Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices