31.190 电子元器件组件 标准查询与下载

GOST R 59630-2021 在印刷电路板上安装表面贴装产品 设计方法

Installation of surface-mounted products on printed circuit boards. Design methods

KS C IEC 62137-1-1-2020 表面贴装技术 表面贴装焊点环境和耐久性试验方法 第1 1部分：拉力试验

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1－1：Pull strength test

KS C IEC 62137-1-2-2020 表面贴装技术 表面贴装焊点的环境和耐久性试验方法 第1-2部分：剪切强度试验

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test

KS C IEC 61193-1-2020 质量评估体系 第1部分：印制板组件缺陷的登记和分析

Quality assessment systems－Part 1：Registration and analysis of defects on printed board assemblies

KS C IEC 61193-2-2020 质量评估体系 第2部分：电子元件及封装件检验抽样方案的选择和使用

Quality assessment systems－Part 2：Selection and use of sampling plans for inspection of electronic components and packages

KS C IEC 62137-2020 环境和耐久性测试 面阵型封装FBGA、BGA、FLGA、LGA、SON和QFN表面贴装板的测试方法

Environmental and endurance testing－Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

BS EN 61760-4:2015+A1:2018 表面安装技术 湿敏器件的分类、包装、标签和处理

1   Scope This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to • semiconductor devices, • devices for flow (wave) soldering. NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749‑20 or J-STD-020 and J-STD-033, are described in the INTRODUCTION.

Surface mounting technology - Classification, packaging, labelling and handling of moisture sensitive devices

T/GDEIIA 1-2020 车载电容式触摸屏技术规范

本标准主要涵盖了车载电容式触摸屏的结构形式及触摸相关的电气性能指标、触控性能参数指标，包括首次触摸响应时间、报点频率、线性度、精准度、灵敏度，光学性能参数指标，包括雾度、透光率、反射率、ITO电极影痕迹及桥点隐蔽性，机械性能指标，化学及环境负荷性能等

Technical Specification For Automotive Capacitive Touch Panel

IEC TR 61191-7:2020 印制板组件.第7部分:组件和印制板组件的技术清洁度

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC 62878-1:2019 器件嵌入组装技术第1部分:器件嵌入基板总规范

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

IEC 62878-2-5:2019 设备嵌入组装技术.第2-5部分:指南.设备嵌入基板三维数据格式的实现

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

IEC 60068-2-69:2017+AMD1:2019 CSV 环境试验第2-69部分:试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC 60068-2-69:2017/AMD1:2019 修改件1.环境试验.第2-69部分:试验.试验Te/Tc:用润湿平衡（测力）法对电子元件和印制板进行可焊性试验

Amendment 1 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

IEC TR 62878-2-7:2019 器件嵌入组装技术.第2-7部分:指南.无源嵌入电路板的加速应力试验

Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

T/CQCBDS 0016-2018 两轴动力驱动控制系统标准

包含产品试验项目、试验标准、试验条件、抽样法则等。

Two-axis power drive control system standard

IEC 60068-2-67:2019 环境试验第2-58部分:试验试验Td:表面安装器件（SMD）的可焊性、耐金属化物溶解性和耐焊接热的试验方法

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

T/GBG 0008-2018 LED照明标准光组件接口与性能要求：光源模块3

本标准规定了满足LED照明标准光组件认定条件的光源模块封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

Interface and performance requirements of LED lighting standard optical components: light source module 3

T/GBG 0003-2018 LED照明标准光组件接口与性能要求：1717封装器件

本标准规定了满足LED照明标准光组件认定条件的1717封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

LED Lighting Standard Optical Component Interface and Performance Requirements: 1717 Packaged Devices

T/GBG 0007-2018 LED照明标准光组件接口与性能要求：光源模块2

本标准规定了满足LED照明标准光组件认定条件的光源模块封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

Interface and performance requirements of LED lighting standard optical components: light source module 2

T/GBG 0009-2018 LED照明标准光组件接口与性能要求：光源模块4

本标准规定了满足LED照明标准光组件认定条件的光源模块封装器件（在本标准文中简称为“LED器件”）的接口与性能要求。 本标准包括术语和定义、接口、基本性能与应用性能。

Interface and performance requirements of LED lighting standard optical components: light source module 4