31.190 电子元器件组件 标准查询与下载

DIN EN 61189-2-721:2016 电气材料, 印刷电路板和其它互联结构和组件的试验方法. 第2-721部分: 互连结构材料试验方法. 使用分离介质柱谐振腔法测定微波频率下覆铜板相对介电常数和介质损耗角正切值 (IEC 61189-2-721-2015); 德文版本EN 61189-2-721-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin

GOST R IEC 62421-2016 电子组装技术. 电子模块

Electronics assembly technology. Electronic modules

IEC TR 62878-2-2:2015 嵌入式器件基板.第2-2部分:指南.电气试验

This part of IEC 62878@ which is a Technical Report@ describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material@ which include for example active or passive devices@ discrete components formed in the fabrication process of electronic wiring board@ and sheet formed components. The IEC 62878 series does not apply to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

GSO IEC 61193-1:2015 质量评估系统 第1部分：印制板组件缺陷的登记和分析

This part of IEC 61193 defines methods of registration and analysis of defects on soldered printed board assemblies. Methods are described to allow effective comparison of performance between products, processes and production locations and can serve as a basis for general quality improvement. The standard specifies defect data collection in two categories. Category 1 ppm data: this category provides data for registration purposes intended to enable overall performance comparison of assembly operations. Category 2 ppm data: this category provides data intended for individual subprocess assessment, analysis and control purposes.

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

GSO IEC 62137-1-1:2015 表面安装技术.表面安装焊点的环境和耐久性测试方法. 第1-1部分：拉力测试

The test method described in this part of IEC 62137 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

GSO IEC 62137-1-3:2015 表面安装技术 表面安装焊点的环境和耐久性测试方法 第1-3部分：循环跌落测试

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

GSO IEC 62137-1-2:2015 表面贴装技术 测试环境因素影响和表面贴装焊点耐久性的方法 第1-2部分：剪切强度

The test method described in this part of IEC 62137 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

GSO IEC 62090:2015 使用条形码和二维码的电子元件产品包装标签

This standard applies to labels on the packaging of electronic components for automatic handling. These labels use linear bar code and two-dimensional (2D) symbols. Labels for direct product marking and shipping labels are excluded. Labels required on the packaging of electronic components that are intended for the retail channel of distribution are also excluded from this standard. Bar code and 2D symbols markings are used, in general, for automatic identification and automatic handling of components in electronics assembly lines. Intended applications include systems that automate the control of component packages during production, inventory and internal distribution.

Product package labels for electronic components using bar code and two-dimensional symbologies

IEC PAS 62878-2-5:2015 设备嵌入式基板.指南.数据格式

Device embedded substrate - Guidelines - Data format

BS EN 61760-4:2015 表面安装技术. 湿度敏感器件的分类, 包装, 标记和处理

Surface mounting technology. Classification, packaging, labelling and handling of moisture sensitive devices

EN 61760-4:2015 表面贴装技术 第4部分：湿敏器件的分类、包装、标签和处理

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC 62878-1-1:2015 设备嵌入式基板 - 第1-1部分:通用规范 - 测试方法

Device embedded substrate - Part 1-1: Generic specification - Test methods

IEC 61760-4:2015 表面贴装技术 - 第4部分:水分敏感器件的分类 包装 标签和处理

This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat@ and provisions for packaging@ labelling and handling. This part of IEC 61760 extends the classification and packaging methods to such components@ where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging. This standard applies to devices intended for reflow soldering@ like surface mount devices@ including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering)@ but not to ? semiconductor devices@ ? devices for flow (wave) soldering. NOTE Background of this standard and its relation to currently existing standards@ e.g. IEC 60749-20 or J-STD- 020 and J-STD-033@ are described in the INTRODUCTION.

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC TS 62878-2-4:2015 器件嵌入基板第2-4部分:指南试验元件组（TEG）

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

BS EN 62137-4:2014 电子组装技术 区域阵列型封装表面安装器件焊点的耐久性试验方法

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

GOST R IEC 61193-1-2015 质量评估体系. 第1部分. 印制版组装件缺陷的登记和分析

Quality assessment systems. Part 1. Registration and analysis of defects on printed board assemblies

GOST R 56427-2015 无线电电子装置电子模块的焊接. 使用无铅和常规技术的自动混合和表面安装. 技术操作实施的技术要求

Soldering of electronic modules of radio-electronic means. Automated mixed and surface mounting using lead-free and conventional technology. Technical requirements for the implementation of technological operations

GSO IEC 61192-1:2014 焊接电子组件的行业要求 第1部分：概述

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon. The purpose of this standards is: a) to define requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies; b) to enable achievement of high yields and high product quality through process control in production: c) to enable the suppliers and users of electronic assemblies to specify good manufacturing practice as part of a contract.

Workmanship requirements for soldered electronic assemblies - Part 1: General

GSO IEC 61190-1-2:2014 电子组件粘合材料 第1-2部分：电子组件中高质量互连焊膏的要求

This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

GSO IEC 61192-4:2014 焊接电子组件的行业要求 第4部分：外围组件

This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surfacemounting or other related assembly technologies, for example through-hole, wires.

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies