31.190 电子元器件组件 标准查询与下载

GSO IEC 61188-5-6:2014 印制板和印制板组件 设计和使用 第5-6部分：粘合注意事项 四个侧面带有 J 线的薄带支架

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of resulting solder joints. Each clause contains a specific set of criteria, setting out details on the component, the component dimensions, the solder joint design and the land pattern dimensions. NOTE The acronym QFJ is the naming convention used by Japan; the acronym PLCC is the naming convention used by the USA for these components.

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

GSO IEC 61192-1:2014 焊接电子组件的行业要求 第1部分：概述

This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon. The purpose of this standards is: a) to define requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies; b) to enable achievement of high yields and high product quality through process control in production: c) to enable the suppliers and users of electronic assemblies to specify good manufacturing practice as part of a contract.

Workmanship requirements for soldered electronic assemblies - Part 1: General

GSO IEC 61192-4:2014 焊接电子组件的行业要求 第4部分：外围组件

This part of IEC 61192 specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surfacemounting or other related assembly technologies, for example through-hole, wires.

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

GSO IEC 60939-2-1:2014 完整的 RFI 抑制滤波器模块 第2-1部分：详细规范正在准备中 无源 EMI 抑制滤波器模块 滤波器的安全测试要求（额定级别 D/DZ）

is a supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specifications. In the preparation of detail specifications, the content of 1.4 of the sectional specification shall be taken into account. The use of IEC 60939-2-2 may be more appropriate for components where approval and requalification tests contribute considerably to the cost of the product, whereas the employment of this specification may be necessary for components manufactured in mass production. This specification offers the assessment levels D and DZ (Zero defect).

Complete filter units for radio interference suppression - Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ)

GSO IEC 61190-1-1:2014 电子组件粘合材料 第1-1部分：电子组件中高质量互连的助焊剂要求

This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

GSO IEC 60939-2-2:2014 用于抑制无线电干扰的完整滤波器装置 第2-2部分：空白详细规范 用于抑制电磁干扰的无源滤波器套件 需要进行安全测试的滤波器（仅安全测试）

IEC 60939-2-2:2004 forms the basis for a uniform procedure for a common Safety Mark. It implements the approval schedule for the safety test described in IEC 60939-2, requires a declaration of design for parameters relevant to safety and prescribes conformance tests to be conducted on every lot prior to its release and requalification tests depending on changes to the declared design.

Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter uits for electromagnetic interference suppression - Filters for which safety tests are required (safety tests only)

GSO IEC 61190-1-2:2014 电子组件粘合材料 第1-2部分：电子组件中高质量互连焊膏的要求

This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

GSO IEC 61191-2:2014 印刷面板组件 第2部分：分规范 表面安装焊接组件的要求

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

GSO IEC 61192-2:2014 焊接电子组件的工艺要求 第2部分：表面安装组件

This part of IEC 61192 specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting. It does not include metal or ceramic-based hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate.

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

GSO IEC 61192-5:2014 焊接电子组件的行业要求 第5部分：焊接电子组件的返工、修改和维修

This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. This part of IEC 61192 also contains guidance on design matters where they have relevance to rework. NOTE Typical in-process surface-mount rework activities to which this standard applies are shown in Figure 1.

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

DB34/T 2220-2014 无砷电子铜箔

本标准规定了无砷电子铜箔（以下简称铜箔）的型号与规格、技术要求、试验方法、检验规则以及标志、包装、运输、贮存。 本标准适用于印制电路板及其它用无砷电子铜箔。

Arsenic-free electronic copper foil

DB34/T 2221-2014 锂离子电池用电子铜箔

本标准规定了锂离子电池用电子铜箔（以下简称锂电铜箔）的产品分类、技术要求、试验方法、检验规则以及标志、包装、运输、贮存 。 本标准适用于锂离子电池、聚合物锂离子电池及动力锂离子电池用电子铜箔。

Electronic Copper Foil for Li-ion Batteries

JIS C 62137-3:2014 电子组装技术. 第3部分: 焊接点的环境和耐久性试验方法选择指南

Electronics Assembly Technology.Part 3: Selection guidance of environmental and endurance test methods for solder joints

BS EN 61190-1-2:2014 电子组装件用附件材料.电子组装件中高质量互联用焊剂的要求

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

EN 61190-1-2:2014 电子组装用连接材料 第 1-2 部分：电子组装中高质量互连用焊膏的要求

IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition: a) modification of the solder powder size in Table 2; b) addition of the information of 'Reflow condition and profile' in Annex B; c) addition of a new Annex C.

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

GSO IEC 62137-1-5:2013 表面贴装技术 表面贴装焊接接头的耐久性和环境试验方法 零件编号（1-5）：机械剪切应力试验

IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

GSO IEC 62137-1-4:2013 表面贴装技术 表面贴装焊点的耐久性和环境测试方法 零件编号（1-4）：循环弯曲测试

The test method described in IEC 62137-1-4:2009 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

GSO IEC 62137-3:2013 电子组装技术 焊点耐久性和环境测试方法选择指南

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes.

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

GSO IEC/PAS 62588:2013 对元件、PCB、PCBA进行标记和标记 以识别有铅、无铅等属性

IEC/PAS 62588:2008(E) applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. IEC/PAS 62588:2008(E) also applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This document applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs).

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

KS C IEC 61188-5-6-2013 印制板和印制板组件 ?设计和使用 第5-6部分：连接（焊盘/接头）考虑因素 四侧带有J引线的芯片载体

Printed boards and printed board assemblies ? Design and use－Part 5-6：Attachment(land/joint) considerations－Chip carriers with J-leads on four sides