31.190 电子元器件组件 标准查询与下载
共找到 380 条与 电子元器件组件 相关的标准，共 26 页
Printed boards and printed board assemblies ? Design and use－Part 5-6：Attachment(land/joint) considerations－Chip carriers with J-leads on four sides
- ICS
- 31.190
- CCS
- 发布
- 2013-12-18
- 实施
本标准规定了特种识别印记的术语和定义、环境要求、安装要求、耐环境性试验要求和性能检测要求。 本标准适用于固体承载物上制作的特种识别印记的检测。
Special identification imprint detection
- ICS
- 31.190
- CCS
- L08
- 发布
- 2013-09-29
- 实施
- 2013-10-20
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
- ICS
- 31.190
- CCS
- 发布
- 2013-07-25
- 实施
- 2013-07-25
IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit t
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
- ICS
- 31.190
- CCS
- 发布
- 2013-06-20
- 实施
- 2013-06-20
IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein permit the use of different sampling plans that may be applied to an individual attribute or set of attributes, according to classification of importance with regard to form, fit and function.
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
- ICS
- 31.190
- CCS
- 发布
- 2013-04-26
- 实施
- 2013-05-23 (7)
Printed boards and printed board assemblies. Design and use. Part 1-1. Generic requirements. Flatness considerations for electronic assemblies
- ICS
- 31.190
- CCS
- 发布
- 2013
- 实施
- 2015-03-01
Printed boards and printed board assemblies. Design and use. Part 5-2. Attachment (land/joint) considerations. Discrete components
- ICS
- 31.190
- CCS
- 发布
- 2013
- 实施
- 2015-03-01
Printed boards and printed board assemblies. Design and use. Part 5-6. Attachment (land/joint) considerations. Chip carriers with J-leads on four sides
- ICS
- 31.190
- CCS
- 发布
- 2013
- 实施
- 2015-03-01
Modular order for the development of mechanical structures for radioelectronic equipment. Part 2. Sectional standard. Interface coordination dimensions for the 25 mm equipment practice. Section 2. Detail standard. Dimensions for subracks, chassis, backpla
- ICS
- 31.190
- CCS
- 发布
- 2013
- 实施
- 2014-03-03
Workmanship requirements for soldered electronic assemblies－Part 5：Rework, modification and repair of soldered electronic assemblies
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
Workmanship requirements for soldered electronic assemblies－Part 5：Rework, modification and repair of soldered electronic assemblies
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
이 표준은 납땜된 전자조립품에 대한 개조, 재작업, 수리 절차에 적용할 수 있는 정보와 요
Workmanship requirements for soldered electronic assemblies－Part 5：Rework, modification and repair of soldered electronic assemblies
- ICS
- 31.190
- CCS
- J33
- 发布
- 2012-11-19
- 实施
- 2012-11-19
Electronics assembly technology－Selection guidance of environmental and endurance test methods for solder joints
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
Electronics assembly technology－Selection guidance of environmental and endurance test methods for solder joints
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
이 표준은 전자 모듈의 부분 표준을 기반으로 하는 전자 모듈의 일반적인 표준을 제시한다.
Electronics assembly technology－Electronic modules
- ICS
- 31.190
- CCS
- K59
- 发布
- 2012-11-19
- 实施
- 2012-11-19
이 표준은 다양한 납땜 자재를 포함한 표면실장 기기(SMD) 및 리드 장치의 다양한 모양
Electronics assembly technology－Selection guidance of environmental and endurance test methods for solder joints
- ICS
- 31.190
- CCS
- M33
- 发布
- 2012-11-19
- 实施
- 2012-11-19
Electronics assembly technology－Electronic modules
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
Electronics assembly technology－Electronic modules
- ICS
- 31.190
- CCS
- 发布
- 2012-11-19
- 实施
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type de
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
- ICS
- 31.190
- CCS
- 发布
- 2012-04-20
- 实施
- 2012-04-20
Electronics assembly technology -- Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011)
- ICS
- 31.190
- CCS
- 发布
- 2012-03-15
- 实施
- 2012-03-15
