31.190 电子元器件组件 标准查询与下载
共找到 380 条与 电子元器件组件 相关的标准，共 26 页
IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following: - no technical changes; - some editorial changes and corrections; - for the sake of convenience some constitutive changes.
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
- ICS
- 31.190
- CCS
- 发布
- 2012-01-20
- 实施
- 2012-03-13 (7)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Part 2. Test methods for materials for interconnection structures
- ICS
- 31.190
- CCS
- L30
- 发布
- 2012
- 实施
- 2013-07-01
Test methods for electrical materials, interconnection structures and assemblies. Part 1. General test methods and methodology
- ICS
- 31.190
- CCS
- 发布
- 2012
- 实施
- 2013-07-01
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test
- ICS
- 31.190
- CCS
- L10
- 发布
- 2011-12-20
- 实施
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test
- ICS
- 31.190
- CCS
- L10
- 发布
- 2011-12-20
- 实施
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test
- ICS
- 31.190
- CCS
- L10
- 发布
- 2011-12-20
- 实施
Modular order for the development of mechanical structures for electronic equipment practices. Part 2. Sectional specification. Interface coordination dimensions for the 25 mm equipment practice
- ICS
- 31.190
- CCS
- 发布
- 2011
- 实施
- 2012-07-01
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing processSpecial electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Ex
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- 发布
- 2010-12-19
- 实施
- 2010-12-19
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007/A1:2010)
- ICS
- 31.190
- CCS
- 发布
- 2010-12-15
- 实施
- 2010-12-15
Attachment materials for electronic assembly - Part 1-3 : requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.
- ICS
- 31.190
- CCS
- L24
- 发布
- 2010-12-01
- 实施
- 2010-12-24
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- 发布
- 2010-11-10
- 实施
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiplealloy solder powders, etc.
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- J33;L10
- 发布
- 2010-11-01
- 实施
- 2010-11-01
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering (IEC 61760-3:2010)
- ICS
- 31.190
- CCS
- 发布
- 2010-09-30
- 实施
- 2010-09-30
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering
- ICS
- 31.190
- CCS
- L10
- 发布
- 2010-06-30
- 实施
- 2010-06-30
Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
- ICS
- 31.190
- CCS
- 发布
- 2010-06-10
- 实施
Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages
- ICS
- 31.190
- CCS
- L10
- 发布
- 2010-05-20
- 实施
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test
- ICS
- 31.190
- CCS
- L10
- 发布
- 2010-05-20
- 实施
Surface mounting technology -- Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test
- ICS
- 31.190
- CCS
- L10
- 发布
- 2010-05-20
- 实施
IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
- ICS
- 31.190
- CCS
- 发布
- 2010-04-23
- 实施
- 2010-07-01 (7)
Soldered electronic assemblies. Workmanship requirements. Part 4. Terminal assemblies
- ICS
- 31.190
- CCS
- 发布
- 2010
- 实施
- 2011-07-01
